According to a new press release, “Ranovus Inc., a leading provider of multi-terabit interconnect solutions for data center and communications networks, today announced the launch of its Odin™ platform. Odin™ scales Ranovus’ 100Gbps per lambda silicon photonics engine from 800Gbps to 3.2Tbps in a single chip supporting both module and Co-Packaged Optics solutions. Ranovus’ Odin™ platform incorporates the company’s disruptive innovation in multi-wavelength Quantum Dot Laser (QDL), 100Gbps silicon photonics based Micro Ring Resonator modulators and photodetectors, 100Gbps Driver, 100Gbps TIA and control Integrated Circuits supported by a Tier 1 packaging ecosystem.”

Hamid Arabzadeh, Chairman and CEO at Ranovus, said, “ML/AI are the driving forces behind innovation in our society. They have created new compute, storage and networking paradigms inside and outside the data center. The massive growth in data traffic fueling the algorithms requires scalable and power efficient networking technologies. Odin™ platform delivers 50% power consumption/Gbps reduction and 75% cost/Gbps reduction over today’s solutions… Odin 8 marks the beginning of the road to multi-terabit Co-Packaged Optics for Compute, Storage and Networking solutions.”

Read more at Business Wire.

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